Microelectronics Design

Chip Edge reduced
Crossfield Technology usually expresses its intellectual property (IP) as an integrated circuit. We develop harsh environment instrumentation systems, novel sensors, and RF/analog/mixed signal circuits. These designs are developed for commercial foundry processes from 0.35 µm to 65 nm, as well as emerging processes such as wide bandgap. Crossfield’s engineers have developed microcircuits in GaAs and RF MEMs.

Our integrated circuit design and development capabilities include:
  • requirements/interface specification and system simulation
  • circuit design
  • simulation using SystemVue, SPICE, MATLAB, Microwave Office, or one of the other specialty tools used in circuit design
  • design verification
  • SoC integration support
  • test support

Crossfield has a experience with a broad range of process technologies including:
  • CMOS
  • SiGe
  • SOI
  • GaAs
  • Wide Band Gap
  • MEMS
  • Organic Thin Film

ASIC Re-Engineering

Crossfield Technology has developed a highly automated process for the rapid extraction of an ASIC design and the retargeting of that design to a modern process technology. This technology enables form, fit, and function replacement of otherwise obsolete and no longer available semiconductor devices to be generated in a cost effective fashion with little or no design documentation. Crossfield is using this technology to support industrial and military systems which might otherwise lose functionality due to the unavailability of replacement parts.