Connecting the Internet of Things

Crossfield Technology’s experienced team of engineers works with customers to architect, design, develop and test products, real-time software, embedded firmware, printed circuit boards, and integrated circuits for their application. Crossfield teams with local contract manufacturers and compliance test facilities to bring your product to market quickly and efficiently.


System Design

Crossfield’s team includes engineers and scientists with years of experience developing data acquisition, instrumentation and sensor/RF systems over high-speed wired and wireless networks. The team is experienced at creating system architectures and detailed designs to meet customer’s requirements. The designs are validated at the system level using MATLAB/Simulink and other simulation tools.
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PCB Design

Crossfield uses Altium Designer to perform schematic capture and place and route of printed circuit boards. Altium Designer allows Crossfield to create 3D models of components and printed circuit boards to ensure the design meets the required form factor. The models may be exported to perform a thermal analysis using external tools as well. Our skilled engineering team has experience with state-of-the-art manufacturing technologies including via-in-pad, blind and buried vias, backdrilling vias, and 3-mil trace width and spacing on boards ranging from 2 to 20+ layers.

Crossfield uses AWR/Microwave Office for design of RF and microwave circuits, including RF printed circuits boards and integrated microwave assemblies.

Embedded Firmware Design

Crossfield’s engineers are experienced with several different programming environments and Software Development Kits for microcontrollers, embedded Linux, and Field Programmable Gate Arrays (FPGAs), including
  • Freescale CodeWarrior for MPUs and QorIQ Processors
  • Yocto Project for Embedded Linux
  • Xilinx Vivado Design Suite
  • Altera Quartus
  • Microsemi Libero IDE
  • Mentor ModelSim
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Software Design

Crossfield’s software development team has experience with real-time data acquisition, signal processing using heterogeneous processors, and advanced networking technologies. Crossfield develops data acquisition software using ‘C’ and C++ and the LabVIEW™ programming environment. Crossfield is experienced in signal processing applications for HPC systems using ‘C’, C++, OpenCL and CUDA, targeting CPUs, GPUs and FPGAs. Crossfield’s high-performance, wire-speed, data streaming applications use the Open Fabrics Enterprise Distribution (OFED) for Remote Direct Memory Access (RDMA) over InfiniBand and Ethernet fabrics.

Analog/Mixed-Signal IC Design

Crossfield’s scientists and engineers have experience developing analog/mixed-signal integrated circuits in a range of semiconductor process technologies. Our experience includes circuit design, simulation, layout, verification, packaging and test.

Crossfield uses the Mentor-Tanner Analog/Mixed-Signal IC Design Flow for schematic design, simulation, layout, verification and tapeout of integrated circuits. Silvaco SmartSPICE is used for functional, performance and timing simulation at the device level. Mentor ModelSim is used for design simulation at the behavorial, RTL and gate level. Crossfield’s engineers have extensive experience in Verilog and VHDL design and simulation, and test bench development and verification.

These designs target commercial foundry processes, as well as specialized processes such as wide bandgap semiconductors.

Our integrated circuit design and development capabilities include:
  • Requirements definition and interface specification
  • System simulation using MATLAB/Simulink
  • Circuit design (transistor, gate or RTL level)
  • Simulation using SPICE or VHDL/Verilog
  • Design verification
  • Packaging & Test support

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IC Reverse Engineering

Crossfield developed a highly automated reverse engineering process for the rapid extraction of an integrated circuit design, and to enable the retargeting of an obsolete design to a modern process technology. Crossfield, working with Cerium Labs and Smart Imaging, has developed ChipReveal™ technology, which enables a cost effective form, fit, and function replacement of an obsolete or otherwise unavailable semiconductor device. ChipReveal does not depend upon any prior information on the process, design, functionality or signals. Crossfield uses this technology to support industrial and military systems which might otherwise require a redesign or re-certification due to component obsolescence.